{"id":3472,"date":"2021-10-11T12:43:02","date_gmt":"2021-10-11T12:43:02","guid":{"rendered":"http:\/\/pciautotronics.com\/?page_id=3472"},"modified":"2021-10-14T21:01:14","modified_gmt":"2021-10-14T21:01:14","slug":"t60m60c","status":"publish","type":"page","link":"https:\/\/pciautotronics.com\/index.php\/t60m60c\/","title":{"rendered":"T60M60\u00b0C,<1%RHBakingDryCabinets"},"content":{"rendered":"\t\t
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FINEPLACER\u00ae lambda 2<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Descriptions<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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The ultimate tool for optical assemblies with 0.5 placement micron accuracy offering superior optical resolution and excellent price performance. The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility\u00a0of the table top die bonder to protect your investment in the face of ever-changing challenges.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Feature<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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  • Synchronized control of all process related parameters: force, temperature, time, process environment, illumination, vision<\/li>
  • Extended object field with optics shifting in x<\/li>
  • In-situ process observation in HD<\/li>
  • Overlay vision alignment system (VAS)with fixed beam splitter<\/li>
  • Data\/media logging and reporting function<\/li>
  • Full process access and easy programming<\/li>
  • Proven software ergonomics<\/li>
  • Modular machine platform allows in-field retrofitting<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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    Benefits<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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    • Maximum process reproducibility<\/li>
    • Precise alignment of large components, relative placement capability<\/li>
    • Immediate visual process feedback<\/li>
    • Precise visual alignment of chip and substrate<\/li>
    • Comprehensive process documentation and traceability<\/li>
    • Fast and intuitive process implementation<\/li>
    • Easy to use for new operators<\/li>
    • Easy upgrade to meet new application & technology requirements<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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      Technologies<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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      • Adhesive bonding<\/li>
      • \u00a0Sintering<\/li>
      • Soldering\/eutectic soldering<\/li>
      • Thermocompression bonding<\/li>
      • \u00a0Thermo- \/ultrasonic bonding<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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        Applications<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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        • Acceleration sensor assembly<\/li>
        • Gas pressure sensor assembly<\/li>
        • Ink jet print head assembly<\/li>
        • Laser diode assembly<\/li>
        • \u00a0Laser diode bar assembly<\/li>
        • MEMS<\/li>
        • MOEMS<\/li>
        • NFC device<\/li>
        • RF\/HF module<\/li>
        • RFID module<\/li>
        • VCSEL\/photo diode (array) assembly<\/li>
        • Image sensor assembly<\/li>
        • X-ray detector assembly<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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          Processes<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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          • Chip on Flex \/Film (CoF)<\/li>
          • Chip on Glass (CoG)<\/li>
          • \u00a0Flip chip bonding (face down)<\/li>
          • \u00a0Precise die bonding (face up)<\/li>
          • Wafer level packaging (C2W)<\/li>
          • 2.5D and 3D IC packaging (stacking)<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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            Modules & Options\n<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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            • ACF Module<\/li>
            • Bonding Force (automatic)<\/li>
            • Bonding Force (manual)<\/li>
            • Chip Heating Module<\/li>
            • Component Presentation<\/li>
            • Die Eject Module<\/li>
            • \u00a0Die Flip Module<\/li>
            • Dipping\/Stamping Module<\/li>
            • Direct Component Printing Module<\/li>
            • \u00a0Dispense Module<\/li>
            • Flip Chip Test Module<\/li>
            • Formic Acid Module<\/li>
            • Mask Generator<\/li>
            • Optics Shifting<\/li>
            • \u00a0Process Gas Module<\/li>
            • \u00a0Process Video Module<\/li>
            • Reballing Module<\/li>
            • Scrubbing Module<\/li>
            • \u00a0Substrate Heating Module<\/li>
            • Substrate Support<\/li>
            • \u00a0Target Finder<\/li>
            • \u00a0Ultrasonic Module<\/li>
            • UV Curing Module<\/li>
            • \u00a0Wafer Heating Module<\/li>
            • \u00a0Zoom Optics<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

              FINEPLACER\u00ae lambda 2 Descriptions The ultimate tool for optical assemblies with 0.5 placement micron accuracy offering superior optical resolution and excellent price performance. The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"om_disable_all_campaigns":false,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"disabled","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-3472","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/pciautotronics.com\/index.php\/wp-json\/wp\/v2\/pages\/3472","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pciautotronics.com\/index.php\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/pciautotronics.com\/index.php\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/pciautotronics.com\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/pciautotronics.com\/index.php\/wp-json\/wp\/v2\/comments?post=3472"}],"version-history":[{"count":28,"href":"https:\/\/pciautotronics.com\/index.php\/wp-json\/wp\/v2\/pages\/3472\/revisions"}],"predecessor-version":[{"id":3652,"href":"https:\/\/pciautotronics.com\/index.php\/wp-json\/wp\/v2\/pages\/3472\/revisions\/3652"}],"wp:attachment":[{"href":"https:\/\/pciautotronics.com\/index.php\/wp-json\/wp\/v2\/media?parent=3472"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}