FINEPLACER® pico
Description
The ultimate tool for optical assemblies with 0.5 placement micron accuracy offering superior optical resolution and excellent price performance. The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges.
Features
- Automated Processes
- Overlay vision alignment system(VAS) with fixed beam splitter
- Integrated process Management(IPM)
- Reaal time process observation camera
- Advanced system software with adaptive process library
- Process transfer from system to system
Benefits
- Hands-off die placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, power, process environment, light version
- Immediate visual feedback reduces process development time
- Fast and easy process development, process recording and reporting, photo capture
- Process transfer from R&D to production saves time, guarantees reliable results
Technologies
- Thermocompression bonding
- Thermo-/ ultrasonic bonding
- Soldering(AuSu/ eutectic, Indium, C4)
- Adhesive technology
- UV / thermal curing
- Diffusion Bonding
- Copper Pillar bonding
- Micro mechnical assembly
Applications
- Flip chip bonding(face down)
- Precise die bonding(face up)
- Laser diode, laser diode bar bonding
- Optical engines, VCSEL/Photo diode Bonding
- LED bonding Micro Optics assembly
- MEMS/ MOEMS/ sensor packaging
- 3D packaging
- Water level packaging(W2W, C2W)
- Chip on glass(Cog), chip on flex(CoF)
Modules & Options
- ACF Modules
- Ball Array Placement Modules
- Bonding Force Module(manual, automatic)
- Chip Heating Module
- Die Flip Module
- Die Pick-up Module
- Dispenser Module
- Formic Acid Module
- Optics Shifting
- Probe Testing Module
- Process Gas Module
- Process Video Module
- Scrubbing Module
- Substrate Heating Module
- Ultrasonic Module
- UV Curing Module