pciautotronics

Finetech - germany

Finetech is the leading equipment manufacturer for sub-micron die bonding and advanced SMD rework, providing solutions for each stage of product – from R&D to industrial automated production.

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FINEPLACER® pico rs

Hot Air SMD Rework Station
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.
  • Full hot air rework system
  • One system for rework and micro assembly
  • Industry-leading thermal management
  • Placement accuracy better 5 µm
  • In-situ process observation in HD
  • Data/media logging and reporting function
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Full process access and easy programming
  • Synchronized control of all process related parameters
  • Software controlled top heater calibration
  • Fully manual or semi-automatic machine versions
  • Force controlled component handling
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    FINEPLACER® pico 2

    Multi-Purpose Manual Die Bonder
    The all-new table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies
  • Sub-micron placement accuracy 
  • Superior optical resolution
  • Fully manual or semi-automatic machine versions
  • Individual configurations with process modules
  • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
  • Wide range of controlled bonding forces
  • Various bonding technologies in one recipe
  • In-situ process observation in HD
  • Modular machine platform allows in-field retrofitting during entire service life
  • Synchronized control of all process related parameters
  • Sequence control with predefined parameter
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    FINEPLACER® Femto 2

    Sub-Micron Table Top Die Bonder

    The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments.

    • Multi-chip capability
    • Modular machine platform allows in-field retrofitting during entire service life
    • Large bonding area
    • Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
    • Various bonding technologies in one recipe
    • Integrated scrubbing function
    • Synchronized control of all process related parameters
    • Process and material traceability via TCP (for MES)
    • Data/media logging and reporting function
    • Fully automatic and manual operation
    • Automatic tool management
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