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Finetech - germany
Finetech is the leading equipment manufacturer for sub-micron die bonding and advanced SMD rework, providing solutions for each stage of product – from R&D to industrial automated production.
FINEPLACER® pico rs
Hot Air SMD Rework Station
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.
Full hot air rework system
One system for rework and micro assembly
Industry-leading thermal management
Placement accuracy better 5 µm
In-situ process observation in HD
Data/media logging and reporting function
Overlay vision alignment system (VAS) with fixed beam splitter
Full process access and easy programming
Synchronized control of all process related parameters
Software controlled top heater calibration
Fully manual or semi-automatic machine versions
Force controlled component handling
FINEPLACER® pico 2
Multi-Purpose Manual Die Bonder
The all-new table top flip chip bonder FINEPLACER® lambda 2 builds on its acclaimed predecessor to set new standards in precision die attach and advanced chip packaging for opto-electronic assemblies
Sub-micron placement accuracy
Superior optical resolution
Fully manual or semi-automatic machine versions
Individual configurations with process modules
Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
Wide range of controlled bonding forces
Various bonding technologies in one recipe
In-situ process observation in HD
Modular machine platform allows in-field retrofitting during entire service life
Synchronized control of all process related parameters
Sequence control with predefined parameter
FINEPLACER® Femto 2
Sub-Micron Table Top Die Bonder
The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.3 µm @ 3 sigma that offers unrivaled flexibility for prototyping & production environments.
- Multi-chip capability
- Modular machine platform allows in-field retrofitting during entire service life
- Large bonding area
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Various bonding technologies in one recipe
- Integrated scrubbing function
- Synchronized control of all process related parameters
- Process and material traceability via TCP (for MES)
- Data/media logging and reporting function
- Fully automatic and manual operation
- Automatic tool management