Wafer Fabrication , Wafer Probing, Wafer Dicing , Advance Packaging & Inspection Equipment
|
- Ion Beam Deposition
- ICM Sputtering
- Plasma Ion Beam Assisted Chemical Vapor Deposition
- Automated Optical -wire bonding inspection
- AOI & AXI Wire Bond Inspection
- Inline 3D Xay for inspection
- Wafer Inspection system
- Wafer to Tape & Reel Die sorter
- CIS inspection Machine
- Manual probe station
- Automated Probe station
- Laser Repair machine
- Laser Wafer Cutting System
- Dual Head Strips Laser Marker
- Laser based package singulation system
- 3D Wafer Bump & Wire Bonding AOI
- Wafer Bump 3D Vision Inspection
- advanced Solder Wire bonder
- Solder ball Mounting Equipment
- Laser Assisted bonding