A Die bonder with 5 placement micron to meet all the bonding processes from development to production. Thanks to its modular system architecture, the FINEPLACER® pico ma can be configured for a wide range of die attach and flip chip bonding technologies and applications. To meet new requirements, this manual die bonder can be retrofitted and upgraded throughout its service life. A generous working area supports the precision assembly on particularly large substrates, while the open design makes it easy to flexibly expand the die bonding system with third-party functionalities