FINEPLACER pico ma
Description
A Die bonder with 5 placement micron to meet all the bonding processes from development to production. Thanks to its modular system architecture, the FINEPLACER® pico ma can be configured for a wide range of die attach and flip chip bonding technologies and applications. To meet new requirements, this manual die bonder can be retrofitted and upgraded throughout its service life. A generous working area supports the precision assembly on particularly large substrates, while the open design makes it easy to flexibly expand the die bonding system with third-party functionalities
Features
Product Line
Model | QB-1200-6 | QB-600 | QB-400 | QB-200 |
Product Image | ||||
Humidity Range | 1~50%RH, adjustable | |||
Precision | ±3.0%RH, ±1.0℃ | |||
Voltage | 110V/230V | |||
External dimensions (mm) | W1200*D672*H1820 | W600*D672*H1820 | W600*D672*H1274 | W600*D672*H636 |
Internal dimensions (mm) | W1198*D644*H1618 | W598*D644*H1618 | W598*D644*H1072 | W598*D644*H526 |
Shelf dimensions (mm) | W1155*D530*H20 | W555*D530*H20 | W555*D530*H20 | W555*D530*H20 |
Capacity | 1250L | 624L | 411L | 202L |
No. of Shelf | 5 | 5 | 3 | 2 |
Power consumption | Ave. 20Wh Max. 50W | Ave. 20Wh Max. 50W | Ave. 20Wh Max. 50W | Ave. 20Wh Max. 50W |
Model | QS-1200-6 | QS-600 | ||
Product Image | ||||
Humidity Range | 1~50%RH, adjustable | |||
Precision | ±3.0%RH, ±1.0℃ | |||
Voltage | 110V/230V | |||
External dimensions (mm) | W1200*D672*H1820 | W600*D672*H1820 | ||
Internal dimensions (mm) | W1198*D635*H1647 | W598*D635*H1647 | ||
Shelf dimensions (mm) | W1155*D530*H20 | W555*D530*H20 | ||
Capacity | 1250L | 624L | ||
No. of Shelf | 5 | 5 | ||
Power consumption | Ave. 20Wh Max. 50W | Ave. 20Wh Max. 50W |