pciautotronics

FINEPLACER pico ma

Description

A Die bonder with 5 placement micron to meet all the bonding processes from development to production. Thanks to its modular system architecture, the FINEPLACER® pico ma can be configured for a wide range of die attach and flip chip bonding technologies and applications. To meet new requirements, this manual die bonder can be retrofitted and upgraded throughout its service life. A generous working area supports the precision assembly on particularly large substrates, while the open design makes it easy to flexibly expand the die bonding system with third-party functionalities

Features

Product Line
ModelQB-1200-6QB-600QB-400QB-200
Product Image
Humidity Range1~50%RH, adjustable
Precision±3.0%RH, ±1.0℃
Voltage110V/230V
External dimensions (mm)W1200*D672*H1820W600*D672*H1820W600*D672*H1274W600*D672*H636
Internal dimensions (mm)W1198*D644*H1618W598*D644*H1618W598*D644*H1072W598*D644*H526
Shelf dimensions (mm)W1155*D530*H20W555*D530*H20W555*D530*H20W555*D530*H20
Capacity1250L624L411L202L
No. of Shelf5532
Power consumptionAve. 20Wh
Max. 50W
Ave. 20Wh
Max. 50W
Ave. 20Wh
Max. 50W
Ave. 20Wh
Max. 50W
ModelQS-1200-6QS-600  
Product Image  
Humidity Range1~50%RH, adjustable
Precision±3.0%RH, ±1.0℃
Voltage110V/230V
External dimensions (mm)W1200*D672*H1820W600*D672*H1820  
Internal dimensions (mm)W1198*D635*H1647W598*D635*H1647  
Shelf dimensions (mm)W1155*D530*H20W555*D530*H20  
Capacity1250L624L  
No. of Shelf55  
Power consumptionAve. 20Wh
Max. 50W
Ave. 20Wh
Max. 50W

Specification

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