Wafer Fabrication , Wafer Probing, Wafer Dicing , Assembly , Packaging & Inspection Equipment
- Production Bonders
- R&D Bonders
- Rework Equipment
- Flip Chip Machines for Assembly of Facing Down Chips/Dies
- Reballing/Deballing for Repairing of Defective Solder Balls on BGA
- 3D Package Machines for Interconnecting Dies/Chips On Wafers
- Probe Card Machines for Semiconductor Chips and Modules
- Wafer Level Packaging Services
Inline 3D X-ray Inspection Machine for IGBT Power Modules
- SEM(Tabletop SEM)
- X-Ray Inspection System
- Semiconductor Packaging Systems