Wafer Fabrication , Wafer Probing, Wafer Dicing , Advance Packaging & Inspection Equipment
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- Ion Beam Deposition
- Ion beam Delayering
- Ion Beam Etch
- ICM Sputtering
- PE-CVD Plasma Enhanced Chemical Vapor Deposition
- Magnetron Sputtering (UBM)
- Planer cathodes
- PIB -CVD Plasma Ion Beam Assisted Chemical Vapor Deposition
- Production Bonders
- R&D Bonders
- Rework Equipment
- Wafer Inspection system
- Wafer to wafer Die sorter
- Camera inspection System
- Lens Sorter & Inspection system
- Manual probe station
- Automated Probe station
- Laser Repair machine
- Laser Wafer Cutting System
- Dual Head Strips
- Laser markerLaser – based package singulation system
- 3D Wafer Bump & Wire Bonding AOI Inspection system
- Wafer Bump 3D Vision Inspection
- Flip Chip Machines for Assembly of Facing Down Chips/Dies
- Reballing/Deballing for Repairing of Defective Solder Balls on BGA
- 3D Package Machines for Interconnecting Dies/Chips On Wafers
- Probe Card Machines for Semiconductor Chips and Modules
- Wafer Level Packaging Services
- SEM(Tabletop SEM)
- X-Ray Inspection System
- Semiconductor Packaging Systems
Inline 3D X-ray Inspection Machine for IGBT Power Modules
- Ultra Low Dry Cabinet
- Low RH% Dry Cabinet
- Baking 60 Dry Cabinet
- Automated Optical -wire bonding inspection
- AOI & AXI Wire Bond Inspection
- Inline 3D Xay for inspection